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Mounthead technology for accuracy, speed and quality

Ultra-fine placement head – Midas™
Film Thumbnail - Midas

The Midas mounthead is designed for ultra-sharp precision and is able to handle any type of component from 01005 to QFP and BGA, as well as complex components such as CSP, flip chip and odd-shape. Due to the rigidity and robustness built into its design, Midas delivers high-speed placement, long-term reliability and extremely high accuracy. Combining Midas with our on-the-fly vision system and sophisticated tray solutions, the MY100-series machines are simply the best fine-pitch placers on the market.

 

High speed placement head – HYDRA™ Film Thumbnail - HYDRA

The HYDRA high speed placement head handles eight different components simultaneously, and can significantly increase your throughput. The HYDRA mounts component types from 0201 chips to mid-sized ICs, as well as QFPs and BGAs up to 18 x 18 mm square.

 

Intelligent surface impact control

Intelligent surface impact control

Components are handled delicately with ISIC – Intelligent Surface Impact Control. This is a sophisticated servo system for Z-axis movements which ensures that even the most delicate components are handled in complete safety. It makes sure that the correct, programmable placement force is applied to every component on the board, regardless of package type.

 

On-the-fly electrical verification

Film Thumbnail - Electrical verifier

The Electrical Verifier is able to quickly test the electrical value and dimensions of components and thereby detect mislabeled reels and kitting errors at an early stage without slowing down the production process. This increases production quality and eliminates the need for costly rework. The Electrical Verifier measures the electrical properties of resistors, capacitors, diodes and transistors. For active polarized components the verifier also checks the orientation of the component.

Vision systems for accurate placement

Linescan vision system – high speed

The Linescan Vision System is a high-speed positioning system that provides the ideal solution when mount speed is critical. Taking snap shot pictures up to 50 000 times per second it is capable of inspecting and aligning 01005 to fine pitch and BGA components on-the-fly.

 

Dual vision system – advanced illumination

The Dual Vision System is a two camera approach equipped with advanced programmable lighting that ensures optimal lighting conditions for all package types ranging from flip chips to BGAs. The high-resolution feature allows the system to inspect small fine-pitch and complex components without any loss of precision.

 

Vision auto teach – easy package programming

Components mixed

The AutoTeach function, built into the system software, can create a new package definition in seconds. The unknown package is shown to the vision system and all geometrical data is measured automatically, including the position of the leads, lead width, ball diameter and pitch. Even if the component is not perfect, lead positions will be fine tuned to fit a standard pitch and thereby eliminate measurement errors.

System design

On-the-fly mount order re-optimization

 
The system software includes a background process that automatically re-optimizes the mount sequence to finish the job in the shortest time possible. This means replenishing components and on-the-fly changeovers can be carried out with no, or very minimal, effect on productivity. It is about more than minimizing down time. It is about efficiently keeping production running over the entire shift.

 

Automatic thermal adaption

 
Variations in running temperature invariably affect mechanical operation and with high-performance machines the effect is more pronounced. Automatic thermal adaption is a sophisticated system that keeps the machine fully calibrated, regardless of variations in temperature inside and around the machine. In overcoming the temperature change issue ATA delivers a three-fold improvement in axis positioning accuracy.

 

Active side balancing

 
Internal machine balancing is a well-known challenge for multi-head machines. The classic solution, a fixed, pre-optimized mount sequence, does not behave well in a dynamic environment with on-the-fly feeder changes. Active side balancing upholds efficiency by automatically giving priority to whichever mounthead requires it in order to maintain optimal throughput. This is an extremely useful feature for optimized set-ups when feeder reloading and product changeovers are carried out during ongoing production.

 

Open interfaces  
Information handling is the new bottleneck in modern electronics production. Connectivity between ERP, manufacturing support systems and equipment databases is vital in order to minimize information overhead. In order to facilitate information exchange, MYDATA is using standardized and open interfacing technology throughout our software suite. Extracting the article database, a bill-of-material, or last week's production statistics is done in no time, thanks to easy-to-use implementations, based on for example ODBC and HTTP.

The Midas mounthead is designed for ultra-sharp precision and is able to handle any type of component from QFP's and BGA's to 01005's, as well as complex components such as CSP's and flip chips. An assortment of additional tools means that it can also place odd-shaped components such as long connectors. Due to the rigidity and robustness built into its design, Midas delivers high-speed placement, long-term reliability and extremely high accuracy (placement repeatability is 21 µm at 3 sigma). Combining Midas with the Linescan Vision System and the MYDATA Tray Exchanger (TEX), MY100-series machines are simply the best fine-pitch placers on the market.

Places broadest range of components

Ultra fine pitch

Extremely high accuracy

Mounts complex components at high speed

Durable and low maintenance

Page last changed:  2012-11-05 | Print