MY500 – Jet printing for high mix production 

The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board.

Unparallelled response time
Jet printing is a lean technology as it is completely software driven and contact-free. A new job is programmed offline and sent automatically to the machine. With jet printing, you can take a customer's order in the morning and deliver finished boards in the afternoon.

Ensuring solder joint quality
Solder joint quality is a key factor in ensuring the final quality of any printed circuit board assembly. Jet printing provides full control over each and every solder deposit - you can easily fine-tune the volume, position, area coverage and height of solder paste for each individual pad, component or package on the pcb. This allows for optimized solder paste deposits on even the most complex and densely populated boards. 

Supporting increasing complexity

With optimized solder paste volumes, jet printing can easily and reliably handle challenging components such as QFNs, package-on package (POP) and pin-in-paste components. At the same time, it also opens up new design opportunities, such as using board cavities in order to reduce final assembly height.

The trend in the SMT industry toward miniaturized packages and complex board designs with higher component density move away from the traditional strengths of screen printing technology. A fact recently reinforced in a report from the International Electronics Manufacturing Initiative (iNEMI), which stated, “Screen printing is reaching its limits when it comes to mixing technologies on a board.”

An ability to handle challenging packages means that jet printing is ideally suited also as an add-on technology, depositing solder paste onto previously screen-printed boards in higher-volume production environments.