Clean and repeatable process for pin-in-paste
Paste volume is critical
Pin-in-paste is a commonly used technology, especially for connectors where it can enable mechanically stronger interconnections compared to surface mount devices. The drawback is that it is messy and costly to apply enough solder paste using screen printing and/or preforms.
Shape the deposit to your liking
With jet printing, it is easy to achieve the right amount of solder paste - every time. Entering the PCB thickness, the hole diameter and the diameter of the pin - the software will automatically suggest the optimal solder paste volume. Deposits of solder paste will be built up around the hole - a clean and repeatable process.