Never again compromise on solder joint quality
No more trade-offs due to stencil limitations
Larger components require thick stencils to ensure adequate volume for a reliable electrical and mechanical interconnection. Small components require just a tiny amount of paste, meaning a thin stencil. To complicate matters, all of these components must be mounted on increasingly dense boards. With a jet printer, you never have to compromise with just one, less-than-ideal, average paste thickness for all these applications.
Jet printing vs. screen printing of densely populated boards
- Thick stencils can lead to dry joints for small components.
- Thin stencils leave too little paste for larger components.
- Stepped stencils are expensive and still involve compromise.
- With jet printing, the paste volume and shape are set individually for every solder joint.
Repeatable process – operator independent
By working off-line while the machine is still running, you can fine-tune the volume, height and area coverage of solder paste required for each pad, component or package. Once at the machine, you simply start printing – the operator cannot affect the performance.