Die bonding

For R&D and
mid-volume production

Die bonding

For R&D and
mid-volume production

Die bonding

For R&D and
mid-volume production

Fully automated, high flexibility, high-precision, high-speed

Multiple possibilities, "All-in-one" platform"


Key benefits

Each product family offers unique value propositions but every product delivers on 4 Key Benefits.

Key benefits MRSI

R&D and medium volume solutions

Our solutions remain the standard in the industry delivering 3 and 5 micron accuracy across a complete range of applications. These system delivers an unmatched combination of accuracy, automation, speed and reliability with in-situ assembly processes such as eutectic die bonding, UV epoxy die attach and flip chip assembly (all configurable options).

Two main product families address R&D and medium volume

  • The MRSI-M3 is a 3-Micron Die Bonder optimized for manufacturers of microwave modules, IR sensors, MEMS, multi-chip modules, stacked assemblies, hybrid devices and photonic packages.
  • The MRSI-705 is 5-Micron Die Bonder optimized for high-precision, high-speed component assembly with the largest installed base in the industry in advanced packaging

Both systems have been delivering consistent results in the field over decades. 

For further details download the product brochure on MRSI's website:


Learn more about MRSI

MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” die bonding solutions for electronic and photonics industry.

www.mrsisystems.com

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